Description

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CFC−free extruded polystyrene bonded to 9.5mm Knauf Wallboard. Low thermal conductivity means that thinner laminates can be used compared with expanded polystyrene laminates.

Knauf Thermal Laminate Plus has a Thermal Conductivity figure for wallboard of k = 0.16W/mK and for Extruded Polystyrene of 0.030W/mK.

Thermal Resistance:

27mm = 0.71m2 K/W

35mm = 1.00m2 K/W

40mm = 1.19m2 K/W

45mm = 1.37m2 K/W

55mm = 1.75m2 K/W

Product Code

519753 KNAUF THERMAL LAM PLUS 2400X1200X27MM

556472 KNAUF THERMAL LAMINATE 2400X1200X30MM

603575 KNAUF THERMAL LAM PLUS 2400X1200X35MM

556471 KNAUF THERMAL LAMINATE 2400X1200X22MM